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分類的基礎上 molding
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fiber
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urea
IUPAC名
CAS
EINECS
公式
Molding sand binder
Melamine molding powder
PTFE molding powder resin
Silicone rubber for molding
Polytetrafluoroethylene molding
Urea formaldehyde molding compound
Molding compound mp for semiconductors
Unsaturated polyester molding compounds
Melamine-/melamine-phenol molding compounds
HTV silicone rubber for molding and extrusion
Epoxy molding compound me for semiconductoors
Epoxy molding compound mc-10 for semiconductors
Glass fiber reinforced epoxy molding compound mb
Novolen® polypropylen for injection-molding and extrusion
Lucryl® PMMA, thermoplastic moldings on polymethyl methacrylate
Ultramid® PA, polyamid molding compositions PA6, PA66 and others
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