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Categorias baseado em oldin: acetate acid allyl antioxidizing binder carbonyl carboxylic coating compositions compound compounds dimethyl dimethylether epoxy ether ethyl extrusion fiber fluoro formaldehyde glass hydoxy hydrochloride hydroxy hydroxymethyl hydroxyphenyl injection isob lucryl melamine methacrylate methyl methylbutyl methylpropyl metilsulfate norisob novolen omycin onylphenylether others oxaz pentyl phenol pmma polyamid polyester polyethyleneglyc polymethyl polypropylen polytetrafluoroethylene powder ptfe pyrid pyrr reinforced resin rubber sand semiconductoors semiconductors sieb silicone thermoplastic thiaz thioxo type ultramid unsaturated urea yliden

nome IUPAC

CAS

EINECS

Fórmula

Poldine

596-50-9

Boldine

476-70-0

207-509-9

C₁₉H₂₁NO₄

18777-73-6

105102-20-3

3019-51-0

C₁₉H₂₁NO₄

476-70-0

207-509-9

C₁₉H₂₁NO₄

12704-90-4

C₄₄H₆₂N₂O₁₂

23599-69-1

C₁₈H₁₉NO₄

Solding aid ws-10b

Molding sand binder

Poldine metilsulfate

545-80-2

C₂₁H₂₆NO₃.CH₃O₄S

Norisoboldine acetate

23599-69-1

C₁₈H₁₉NO₄

Boldine dimethylether

Boldine hydrochloride

16625-69-7

240-675-0

C₁₉H₂₁NO₄,HCl

Boldine dimethyl ether

Melamine molding powder

New type golding coating

PTFE molding powder resin

Tin coating solding aid 202

Silicone rubber for molding

Antioxidizing solding aid th-1

Polytetrafluoroethylene molding

Urea formaldehyde molding compound

Polyethyleneglycoldinonylphenylether

28299-18-5

Molding compound mp for semiconductors

cis-3-Fluoro-4-hydoxy-N-boc pyrroldine

1174020-48-4

Unsaturated polyester molding compounds

Melamine-/melamine-phenol molding compounds

HTV silicone rubber for molding and extrusion

Epoxy molding compound me for semiconductoors

Epoxy molding compound mc-10 for semiconductors

Glass fiber reinforced epoxy molding compound mb

3-Ethyl-2-methyl-2-(3-methylbutyl)-1,3-oxazoldine

143860-04-2

C₁₁H₂₃NO

1-(2-Hydroxyphenyl)-2-pyrroldinone-4-carboxylic acid

C₁₁H₁₁NO₄

Novolen® polypropylen for injection-molding and extrusion

2-Thioxo-3-allyl-2-4-oxo-5-(N-methyl-pyrid-2-yliden)-1,3-thiazoldine

34330-15-9

251-943-1

C₁₂H₁₂N₂OS₂

Lucryl® PMMA, thermoplastic moldings on polymethyl methacrylate

Ultramid® PA, polyamid molding compositions PA6, PA66 and others

N4-hydroxy-N1-[(1S)-1[[(2S)-2-(hydroxymethyl)-1-pyrroldinyl]carbonyl]-2-methylpropyl]-2-pentyl-,(2R)-(9ci)

13434-13-4

C₁₉H₃₅N₃O₅

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